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Philips Semiconductors
PCF8594C-2
512 × 8-bit CMOS EEPROM with I 2 C-bus interface
15.4 Package related soldering information
Table 10:
Suitability of IC packages for wave, re?ow and dipping soldering methods
Mounting
Package [1]
Soldering method
Wave
Re?ow [2]
Dipping
Through-hole
DBS, DIP, HDIP, RDBS,
suitable [3]
?
suitable
mount
SDIP, SIL
Through-hole-
PMFP [4]
not suitable
not
?
surface mount
suitable
Surface mount
BGA, LBGA, LFBGA,
not suitable
suitable
?
SQFP, SSOP-T [5] ,
TFBGA, VFBGA
DHVQFN, HBCC, HBGA,
not suitable [6]
suitable
?
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP,
HVQFN, HVSON, SMS
PLCC [7] , SO, SOJ
suitable
suitable
?
LQFP, QFP, TQFP
not
recommended [7][8]
suitable
?
SSOP, TSSOP, VSO,
not recommended [9]
suitable
?
VSSOP
9397 750 14221
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales of?ce.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
Hot bar soldering or manual soldering is suitable for PMFP packages.
These transparent plastic packages are extremely sensitive to re?ow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared re?ow
soldering with peak temperature exceeding 217 ° C ± 10 ° C measured in the atmosphere of the re?ow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 ° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
? Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 05 — 25 October 2004
18 of 21
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相关代理商/技术参数
PCF8594C-2T/02112
制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述:
PCF8594C-2T02
制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:512 X 8-bit CMOS EEPROM with I2C-bus interface
PCF8594E2D
制造商:未知厂家 制造商全称:未知厂家 功能描述:I2C Serial EEPROM
PCF8594E2N
制造商:未知厂家 制造商全称:未知厂家 功能描述:I2C Serial EEPROM
PCF8594P
制造商:未知厂家 制造商全称:未知厂家 功能描述:I2C Serial EEPROM
PCF8594T
制造商:未知厂家 制造商全称:未知厂家 功能描述:I2C Serial EEPROM
PCF8598C-2
制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:256 to 1024 x 8-bit CMOS EEPROMs with I2C-bus interface
PCF8598C2D
功能描述:电可擦除可编程只读存储器 8K/1024 电可擦除可编程只读存储器 I2C BUS RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8